Vá para os arquivos da categoria Notícias (SiC) devices provide superior thermal properties as compared to their counter-part Silicon devices. In applications where the operating temperature exceeds the limitations of Silicon devices, GeneSiC’s portfolio of bare chips and high temperature devices are an ideal solution for continous duty operation in high voltage motor control.
SiC Schottky MPS ™
| Número da peça | Voltagem (V) | Atual para a frente (UMA) | Pacote |
|---|---|---|---|
| GC50MPS06-CAL | 650 | 50 | Chip Bare |
| GC15MPS12-CAL | 1200 | 15 | Chip Bare |
| GC20MPS12-CAL | 1200 | 20 | Chip Bare |
| GC50MPS12-CAL | 1200 | 50 | Chip Bare |
| GC25MPS17-CAL | 1700 | 25 | Chip Bare |
| GAP3SHT33-CAU | 3300 | 0.3 | Chip Bare |
SiC MOSFET
| Número da peça | Voltagem (V) | Na Resistência (mΩ) | Pacote |
|---|---|---|---|
| G3R20MT12-CAL | 1200 | 20 | Chip Bare |
| G3R30MT12-CAL | 1200 | 30 | Chip Bare |
| G3R40MT12-CAL | 1200 | 40 | Chip Bare |
| G3R75MT12-CAL | 1200 | 75 | Chip Bare |
| G3R20MT17-CAL | 1700 | 20 | Chip Bare |
| G3R45MT17-CAL | 1700 | 45 | Chip Bare |
| G3R50MT33-CAL | 3300 | 50 | Chip Bare |
| G3R100MT33-CAL | 3300 | 100 | Chip Bare |
