The superior quality of GeneSiC Semiconductor’s power products is a result of an industry leading technology and high quality of materials that go in to them. For the scope of compliance declaration, GeneSiC Semiconductor classifies its silicon carbide (Sic) products in terms of the product’s industry standard assembly package – GAWIN-214 (SMB), TO-252, TO-263, TO-220, TO-247, TO-46 and SOT-227

The assembly package specific compliance documents can be obtained by clicking the relevant assembly package links on this page

Conflict-free Sourcing

GeneSiC Semiconductor takes very seriously the worldwide concerns that metals mined in the conflict areas of the Democratic Republic of the Congo (DRC).

For GeneSiC’s Conflict Free Sourcing Statement, please click the appropriate package above.

Maabot ang Pagsunod

GeneSiC Semiconductor is supportive of the scope and direction of REACH which is to promote and progress the protection of human health and the environment through careful examination of the properties of chemical substances in our products

Para sa GeneSiC's Reach Compliance Statement, please click the appropriate package above

ROHS pagsunod

GeneSiC Semiconductor ay inilaan upang supply ng impormasyon tungkol sa mga sangkap sa kanyang mga produkto bilang kinakailangan at ay mabilis na tumugon sa hinaharap na mga direksyon sa kapaligiran upang maging tiyak na maaari naming suportahan ang aming mga kinakailangan sa customer.

Para sa genesic's ROHS pagsunod Pahayag, please click the appropriate package above.

Halogen-Free Status

GeneSiC Semiconductor ay nakatuon sa supply Halogen Libreng bahagi upang itaguyod at umunlad ang proteksyon ng kalusugan ng tao at ang kapaligiran sa pamamagitan ng maingat na pagsusuri ng mga katangian ng mga kemikal sangkap.

Para sa GeneSic's Halogen-free Status Statement, please click appropriate package above.

Tin Whisker Report for DO-214, TO-252, TO-220 and TO-247 packaged parts

GeneSiC’s DO-214, TO-252, TO-220, TO-247 packaged parts meet the highest standards of Tin-Whisker avoidance.

For GeneSiC’s Tin Whisker Report, please click appropriate package above.